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Volumn 50, Issue 24, 2009, Pages 5685-5692

An approach to develop high-Tg epoxy resins for halogen-free copper clad laminates

Author keywords

Epoxy; Flame retardant; Phosphorus

Indexed keywords

ADDITION REACTIONS; CURING; FLAME RETARDANTS; LAMINATES; PHOSPHORUS;

EID: 70449411576     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2009.09.075     Document Type: Article
Times cited : (73)

References (33)
  • 1
    • 70449450467 scopus 로고    scopus 로고
    • Komori K, Kashihara K, Ogasawara K, Nozue A, Okada S, Matsushita Electric Works, Ltd, U.S. Patent 6403690, 2002
    • Komori K, Kashihara K, Ogasawara K, Nozue A, Okada S. (Matsushita Electric Works, Ltd). U.S. Patent 6403690, 2002.
  • 2
    • 70449412537 scopus 로고    scopus 로고
    • Nakamura Y, Asano T, Ogasawara KIN, Matsushita Electric Works, Ltd, U.S. Patent 6645630, 2003
    • Nakamura Y, Asano T, Ogasawara KIN. (Matsushita Electric Works, Ltd). U.S. Patent 6645630, 2003.
  • 21
    • 70449448349 scopus 로고    scopus 로고
    • Copper clad laminates based on the resins and their derivatives are produced by Nan Ya Plastics Corporation
    • Copper clad laminates based on the resins and their derivatives are produced by Nan Ya Plastics Corporation.
  • 26
    • 0003495893 scopus 로고
    • Odian G. (Ed), Wiley-Interscience
    • In: Odian G. (Ed). Principle of polymerization. 3rd ed. 108 (1991), Wiley-Interscience
    • (1991) Principle of polymerization. 3rd ed. , vol.108


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.