Electrotreatment of industrial copper plating rinse effluent usingmild steel and aluminum electrodes

Journal of Chemical Technology and Biotechnology

Volumn 84, Issue 12, 2009, Pages 1803-1810

  Golder, Animes K ^a   Dhaneesh, Varappurath S ^b   Samanta, Amar N ^c   Ray, Subhabrata ^c  

^a INDIAN INSTITUTE OF TECHNOLOGY GUWAHATI   (India)

^b Bharat Petroleum Corporate R and D Centre ^*  (India)

^c INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Copper; Electrotreatment; Hydroxide precipitation; Plating effluent

Indexed keywords

ALUMINUM ELECTRODES; BACK GROUND ELECTROLYTE; COMBINED EFFECT; DISCHARGE LIMIT; ELECTROCHEMICAL TECHNIQUES; ELECTRODE ARRANGEMENT; ELECTRODE MATERIAL; ELECTROTREATMENT; EXPERIMENTAL CONDITIONS; HYDROXIDE PRECIPITATION; INDUSTRIAL PLATING; MILD STEEL; ON CURRENTS; OXIDE LAYER; PLATING INDUSTRY; RINSE WATER; SOLUTION CONDUCTIVITY; TREATMENT TIME;

ALUMINUM; CARBON STEEL; COPPER; EFFLUENT TREATMENT; EFFLUENTS; ELECTRIC DISCHARGES; ELECTROPLATING; HEAVY METALS; METAL RECOVERY; SODIUM CHLORIDE; WASTEWATER; WASTEWATER TREATMENT; ZINC;

ELECTROCHEMICAL ELECTRODES;

ALUMINUM; COPPER; HYDROXIDE; SODIUM CHLORIDE; STEEL; ZINC;

ARTICLE; EFFLUENT STANDARD; ELECTRIC CONDUCTIVITY; ELECTRODE; ELECTROPLATING INDUSTRY; HEAVY METAL REMOVAL; PH MEASUREMENT; POWER ANALYSIS; PRECIPITATION; REACTION TIME; WASTE WATER MANAGEMENT;

EID: 70449381346     PISSN: 02682575     EISSN: 10974660     Source Type: Journal    
DOI: 10.1002/jctb.2249     Document Type: Article

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