Metallization of high aspect ratio, out of plane structures

3rd International Workshop on Advances in Sensors and Interfaces, IWASI 2009

Volumn , Issue , 2009, Pages 193-196

  Vazquex, Patricia ^a   Dimaki, Maria ^a   Svendsen, Winnie E ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE ELECTRODES; BRAIN TISSUE; ELECTROCHEMICAL MEASUREMENTS; ELECTRODE FABRICATION; HIGH ASPECT RATIO; METALLIZATION PROCESS; METALLIZATIONS; NEURONAL CELL; ON CHIPS; OUT-OF-PLANE; RECORDED SIGNALS; SIDE WALLS; SURFACE AREA; THREE-DIMENSIONAL STRUCTURE;

CELL CULTURE; ELECTRIC CORONA; ELECTRODES; INDOOR AIR POLLUTION; METALLIZING; SENSORS; SIGNAL TO NOISE RATIO;

ASPECT RATIO;

EID: 70449378002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWASI.2009.5184794     Document Type: Conference Paper

References (7)

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