Fully-coupled numerical analysis of high-frequency induction heating for thin-wall injection molding

Polymer - Plastics Technology and Engineering

Volumn 48, Issue 10, 2009, Pages 1070-1077

  Eom, Hyeju ^a   Park, Keun ^a  

^a Seoul National University of Science and Technology   (South Korea)

Author keywords

Coupled field analysis; Induction heating; Injection molding; Numerical analysis; Thin wall molding

Indexed keywords

COUPLED-FIELD ANALYSIS; FULLY-COUPLED; HEAT TRANSFER ANALYSIS; HIGH FREQUENCY INDUCTION HEATING; INJECTION MOLDING SIMULATION; INJECTION MOLDS; INTEGRATED SIMULATIONS; METAL PARTS; MICRO/NANOSTRUCTURES; MOLD TEMPERATURES; NUMERICAL INVESTIGATIONS; RAPID MOLD; THERMAL BOUNDARY CONDITIONS; THIN WALL MOLDING; THIN WALLS; THIN-WALL PARTS; THIN-WALLED PARTS;

CONDUCTIVE MATERIALS; ELECTROMAGNETIC FIELD EFFECTS; ELECTROMAGNETIC FIELDS; ELECTROMAGNETIC INDUCTION; HEATING; INDUCTION HEATING; NUMERICAL ANALYSIS; PLASTIC MOLDS; THIN WALLED STRUCTURES;

INJECTION MOLDING;

COMPUTER SIMULATION; HEATING; INJECTION MOLDING; MATHEMATICAL ANALYSIS; STRUCTURAL PROPERTY; TEMPERATURE;

EID: 70449346731     PISSN: 03602559     EISSN: 15256111     Source Type: Journal    
DOI: 10.1080/03602550903092484     Document Type: Article

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