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Volumn 6, Issue 11, 2004, Pages 1259-1267
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Structure refinement, physical properties and electronic structure of new electrochemically copper intercalated group Vb ditellurides Cu xMTe 2 (M=V, Nb, Ta)
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Author keywords
Copper intercalation; Copper niobium telluride; Copper tantalum telluride; Copper vanadium telluride; Layer compounds; Short CuCu distances; TB LMTO ASA
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Indexed keywords
DITELLURIDES;
STRUCTURE REFINEMENT;
CORRUGATED MATERIALS;
CRYSTAL STRUCTURE;
ELECTROCHEMISTRY;
ELECTRONIC STRUCTURE;
MAGNETIC SUSCEPTIBILITY;
PARAMAGNETISM;
INTERCALATION COMPOUNDS;
COPPER COMPLEX;
TELLURIUM DERIVATIVE;
ANALYTIC METHOD;
ARTICLE;
AUTOCLAVE;
CHEMICAL BINDING;
CHEMICAL COMPOSITION;
CHEMICAL PROCEDURES;
CHEMICAL REACTION;
CHEMICAL STRUCTURE;
CONDUCTANCE;
CRYSTAL STRUCTURE;
ELECTROCHEMISTRY;
INTERCALATION COMPLEX;
MAGNETISM;
MATHEMATICAL MODEL;
PHYSICAL PARAMETERS;
REACTION ANALYSIS;
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EID: 7044249403
PISSN: 12932558
EISSN: None
Source Type: Journal
DOI: 10.1016/j.solidstatesciences.2004.07.017 Document Type: Article |
Times cited : (7)
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References (51)
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