|
Volumn 636, Issue 1-2, 2009, Pages 30-35
|
Predictive modeling of deposition rate in electro-deposition of copper-tin using regression and artificial neural network
|
Author keywords
Anova; Deposition rate; Electroplating; Neural network; Regression
|
Indexed keywords
BACKPROPAGATION;
BRONZE;
COPPER;
CYANIDES;
DEPOSITION;
DEPOSITION RATES;
FLUORESCENCE SPECTROSCOPY;
PROTECTIVE COATINGS;
REGRESSION ANALYSIS;
TIN;
ANOVA;
ARTIFICIAL NEURAL NETWORK;
COATING COMPOSITIONS;
COPPER-TIN ALLOY;
CYANIDE BATHS;
PREDICTIVE MODELING;
REGRESSION;
REGRESSION MODEL;
X RAY FLUORESCENCE SPECTROSCOPY;
NEURAL NETWORKS;
|
EID: 70350786611
PISSN: 15726657
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jelechem.2009.09.003 Document Type: Article |
Times cited : (11)
|
References (23)
|