Prediction of nanopattern topography using two-dimensional focused ion beam milling with beam irradiation intervals

Microelectronic Engineering

Volumn 87, Issue 1, 2010, Pages 1-9

  Han, Jin ^a   Lee, Hiwon ^a   Min, Byung Kwon ^a   Lee, Sang Jo ^a  

^a Yonsei University   (South Korea)

Author keywords

Ion beam machining; Microfabrication; Patterning; Sputtering simulation

Indexed keywords

ANGLE DEPENDENCE; BEAM IRRADIATION; BI-GAUSSIAN BEAMS; CRITICAL PARAMETER; FIB MILLING; FOCUSED ION BEAM MILLING; ION BEAM MACHINING; ION MILLING; MACHINING EXPERIMENTS; NANO PATTERN; PATTERNING; REDEPOSITION; SILICON SURFACES; SIMULATION-BASED; SPUTTERING YIELDS; TWO-DIMENSIONAL GEOMETRY;

BEAM PLASMA INTERACTIONS; FOCUSED ION BEAMS; GAUSSIAN NOISE (ELECTRONIC); ION BOMBARDMENT; IONS; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; MILLING (MACHINING); SIMULATORS; SPUTTERING; TWO DIMENSIONAL;

GAUSSIAN BEAMS;

EID: 70350712034     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.05.010     Document Type: Article

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