Complex three-dimensional structures in Si{1 0 0} using wet bulk micromachining

Journal of Micromechanics and Microengineering

Volumn 19, Issue 10, 2009, Pages

  Pal, Prem ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3D STRUCTURE; BULK- MICROMACHINING; COMPACT SIZE; CORRUGATED DIAPHRAGM; DELIVERY SYSTEMS; ETCHING STEP; FABRICATION METHOD; FABRICATION PROCESS; FIXED STRUCTURE; FREE-STANDING STRUCTURES; LOCAL OXIDATION OF SILICONS; MEMS-STRUCTURE; MICROELECTROMECHANICAL SYSTEMS; OTHER APPLICATIONS; OXIDE LAYER; SHARP EDGES; SILICON ANISOTROPIC ETCHING; SINGLE WAFER; TETRAMETHYL AMMONIUM HYDROXIDE; THREE-DIMENSIONAL STRUCTURE; TRITON X-100; WET ANISOTROPIC ETCHING;

AMMONIUM COMPOUNDS; ANISOTROPY; COMPOSITE MICROMECHANICS; FABRICATION; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NITRIDES; SEMICONDUCTING SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; SILICONES; THREE DIMENSIONAL; WET ETCHING;

ANISOTROPIC ETCHING;

EID: 70350663007     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/10/105008     Document Type: Article

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