Analysis of challenges for on-chip optical interconnects

Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI

Volumn , Issue , 2009, Pages 275-280

  Dokania, Rajeev K ^a   Apsel, Alyssa B ^a  

^a Cornell University   (United States)

Author keywords

Modulator; On chip optical interconnect; Polarization sensitivity; Ring resonator; Thermal sensitivity

Indexed keywords

DENSE INTEGRATION; GLOBAL ROUTING; ON CHIPS; ON-CHIP OPTICAL INTERCONNECT; ON-CHIP OPTICAL INTERCONNECTS; OPTICAL COMPONENTS; PERFORMANCE BOTTLENECKS; POLARIZATION SENSITIVITY; POSSIBLE SOLUTIONS; RING-RESONATOR; SCALED TECHNOLOGIES; SILICON PHOTONIC DEVICES; SPATIAL BANDWIDTH; TECHNICAL CHALLENGES; THERMAL REGULATION; THERMAL SENSITIVITY; THERMAL STABILIZATION;

ELECTRIC POWER SYSTEM INTERCONNECTION; INTEGRATED OPTICS; LAKES; MODULATION; OPTICAL INTERCONNECTS; POLARIZATION; RESONATORS; ROUTING ALGORITHMS; TEMPERATURE SENSORS;

LIGHT MODULATORS;

EID: 70350593684     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1531542.1531607     Document Type: Conference Paper

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