-
1
-
-
53949119320
-
Performance of coated tungsten carbide tools on milling printed circuit board
-
Lin, Z. C. and Ho, C. Y. Performance of coated tungsten carbide tools on milling printed circuit board. J. Processing Technol., 2009, 209(1), 303-309.
-
(2009)
J. Processing Technol.
, vol.209
, Issue.1
, pp. 303-309
-
-
Lin, Z.C.1
Ho, C.Y.2
-
2
-
-
29244457813
-
Investigation of micro-cutting operations
-
Chae, J., Park, S. S., and Freiheit, T. Investigation of micro-cutting operations. Int. J. Mach. Tools Mf., 2006, 46(3-4), 313-332.
-
(2006)
Int. J. Mach. Tools Mf.
, vol.46
, Issue.3-4
, pp. 313-332
-
-
Chae, J.1
Park, S.S.2
Freiheit, T.3
-
3
-
-
33947337405
-
Chemical milling of circuit panels
-
Shoho, R. M. and Skillman, III, W. E. Chemical milling of circuit panels. Industrial and Engng Chem. Prod. Res. and Dev., 1966, 5(3), 293-300.
-
(1966)
Industrial and Engng Chem. Prod. Res. and Dev.
, vol.5
, Issue.3
, pp. 293-300
-
-
Shoho, R.M.1
Skillman Iii, W.E.2
-
4
-
-
0036570458
-
Preparation of shape-controlled copper oxide powders from copper-containing solution
-
Ko Kim, Y., Riu, D. H., Kim, S. R., and Kim, B. I. Preparation of shape-controlled copper oxide powders from copper-containing solution. Mater. Lett., 2002, 54(2-3), 229-237.
-
(2002)
Mater. Lett.
, vol.54
, Issue.2-3
, pp. 229-237
-
-
Ko Kim, Y.1
Riu, D.H.2
Kim, S.R.3
Kim, B.I.4
-
5
-
-
0025549095
-
Laser drilling of microvias in epoxy-glass printed circuit boards
-
Kestenbaum, A., D'Amico, J. F., Blumenstock, B. J., and Deangelo, M. A. Laser drilling of microvias in epoxy-glass printed circuit boards. IEEE Trans. Components, Hybrids and Mfg Technol., 1990, 13(4), 1055-1062.
-
(1990)
IEEE Trans. Components, Hybrids and Mfg Technol.
, vol.13
, Issue.4
, pp. 1055-1062
-
-
Kestenbaum, A.1
D'Amico, J.F.2
Blumenstock, B.J.3
Deangelo, M.A.4
-
6
-
-
0035310396
-
Laser processing for microelectronics packaging applications
-
Illyefalvi-Vitez, Z. Laser processing for microelectronics packaging applications. Microelectronics Reliability, 2001, 41(4), 563-570.
-
(2001)
Microelectronics Reliability
, vol.41
, Issue.4
, pp. 563-570
-
-
Illyefalvi-Vitez, Z.1
-
7
-
-
0035479934
-
Investigation of laser via formation technology for the manufacturing of high density substrates
-
Zheng, H., Gan, E., and Lim, G. C. Investigation of laser via formation technology for the manufacturing of high density substrates. Optics and Lasers in Engng, 2001, 36(4), 355-371.
-
(2001)
Optics and Lasers in Engng
, vol.36
, Issue.4
, pp. 355-371
-
-
Zheng, H.1
Gan, E.2
Lim, G.C.3
-
8
-
-
34250893772
-
Ultraprecision micromachining of small workpieces with complicated shape
-
Korea
-
Takeuchi, Y. Ultraprecision micromachining of small workpieces with complicated shape. In Proceedings of Nanoengineering Symposium, 2005, Korea, pp. 129-134.
-
(2005)
In Proceedings of Nanoengineering Symposium
, pp. 129-134
-
-
Takeuchi, Y.1
-
9
-
-
0018753258
-
An experimental printed circuit board drilling system automated by pattern recognition
-
McVey, E. S. and Van Tol, A. An experimental printed circuit board drilling system automated by pattern recognition. Pattern Recognition, 1979, 11(4), 271-276.
-
(1979)
Pattern Recognition
, vol.11
, Issue.4
, pp. 271-276
-
-
McVey, E.S.1
Van Tol, A.2
-
10
-
-
0003996593
-
Characteristics of CEM-1 copper clad laminate punching test (in Chinese)
-
Chen, M. F. Characteristics of CEM-1 copper clad laminate punching test (in Chinese). Chem. Engng Technol., 1996, 5, 116-119.
-
(1996)
Chem. Engng Technol.
, vol.5
, pp. 116-119
-
-
Chen, M.F.1
-
11
-
-
70350452240
-
Studies on the punching characteristics of rigid copper clad laminates
-
Hsu, Q. Studies on the punching characteristics of rigid copper clad laminates. J. Natn. Kaohsiung Univ. Appl. Sci., 2004, 33, 31-40.
-
(2004)
J. Natn. Kaohsiung Univ. Appl. Sci.
, vol.33
, pp. 31-40
-
-
Hsu, Q.1
-
12
-
-
0042431133
-
Drilling of printed circuit boards: Factors limiting the use of smaller drill sizes
-
DOI: 10.1243/0954405001517423
-
Hinds, B. K. and Treanor, M. Drilling of printed circuit boards: factors limiting the use of smaller drill sizes. Proc. IMechE, Part B: J. Engineering Manufacture, 2000, 214(B1), 35-45. DOI: 10.1243/0954405001517423.
-
(2000)
Proc. IMechE, Part B: J. Engineering Manufacture
, vol.214
, Issue.B1
, pp. 35-45
-
-
Hinds, B.K.1
Treanor, M.2
-
13
-
-
0036181044
-
Submicron and ultrafine grained hard metals for microdrills and metal cutting inserts
-
Gille, G., Szesny, B., Dreyer, K., van den Berg, H., Schmidt, J., and Gestrich, T. Submicron and ultrafine grained hard metals for microdrills and metal cutting inserts. Int. J. Refractory Metals and Hard Mater., 2002, 20(1), 3-22.
-
(2002)
Int. J. Refractory Metals and Hard Mater.
, vol.20
, Issue.1
, pp. 3-22
-
-
Gille, G.1
Szesny, B.2
Dreyer, K.3
Van Den Berg, H.4
Schmidt, J.5
Gestrich, T.6
-
14
-
-
29144448039
-
Wear of CrC-coated carbide tools in dry machining
-
Su, Y. L., Lia, T. H., Su, C. T., Yao, S. H., Kao, W. H., and Cheng, K. W. Wear of CrC-coated carbide tools in dry machining. J. Mater. Processing Technol., 2006, 171(1), 108-117.
-
(2006)
J. Mater. Processing Technol.
, vol.171
, Issue.1
, pp. 108-117
-
-
Su, Y.L.1
Lia, T.H.2
Su, C.T.3
Yao, S.H.4
Kao, W.H.5
Cheng, K.W.6
-
15
-
-
70350482995
-
-
http://www.Iljindiamond.co.kr.
-
-
-
-
16
-
-
70350433760
-
-
http://www.simmtech.co.kr.
-
-
-
-
17
-
-
70350457611
-
-
http://www.mgc.co.jp.
-
-
-
-
18
-
-
23844481840
-
Micro milling of sintered tungsten-copper composite materials
-
Uhlmann, E., Piltz, S., and Schauer, K. Micro milling of sintered tungsten-copper composite materials. J. Mater. Processing Technol., 2005, 167(2-3), 402-407.
-
(2005)
J. Mater. Processing Technol.
, vol.167
, Issue.2-3
, pp. 402-407
-
-
Uhlmann, E.1
Piltz, S.2
Schauer, K.3
-
19
-
-
58149319893
-
Orthogonal cutting mechanisms of graphite/epoxy composite. Part I: Unidirectional laminate
-
Wang, D. H., Ramula, M., and Arola, D. Orthogonal cutting mechanisms of graphite/epoxy composite. Part I: Unidirectional laminate. Int. J. Mach. Tools Mf., 1995, 35(12), 1623-1638.
-
(1995)
Int. J. Mach. Tools Mf.
, vol.35
, Issue.12
, pp. 1623-1638
-
-
Wang, D.H.1
Ramula, M.2
Arola, D.3
-
20
-
-
70350439944
-
Scalability of tool path planning to micro machining
-
University of Illinois, Urbana-Champaign, Illinois, September paper 28
-
Littwinski, K. M., Min, S. K., Lee, D. E., Dornfeld, D., and Lee, N. K. Scalability of tool path planning to micro machining. In Proceedings of 1st International Conference on Micromanufacturing ICOMM, University of Illinois, Urbana-Champaign, Illinois, September 2006, paper 28.
-
(2006)
Proceedings of 1st International Conference on Micromanufacturing ICOMM
-
-
Littwinski, K.M.1
Min, S.K.2
Lee, D.E.3
Dornfeld, D.4
Lee, N.K.5
-
21
-
-
34249667252
-
Experimental observation of tool wear, cutting forces and chip morphology in face milling of cobalt based super-alloy with physical vapour deposition coated and uncoated tool
-
Aykut, S., Bagci, E., Kentli, A., and Yazicioglu, O. Experimental observation of tool wear, cutting forces and chip morphology in face milling of cobalt based super-alloy with physical vapour deposition coated and uncoated tool. Mater. and Des., 2007, 28(6), 1880-1888.
-
(2007)
Mater. and Des.
, vol.28
, Issue.6
, pp. 1880-1888
-
-
Aykut, S.1
Bagci, E.2
Kentli, A.3
Yazicioglu, O.4
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