A nonuniform transmission-line approach for modeling bends on transmission lines

Microwave and Optical Technology Letters

Volumn 29, Issue 1, 2001, Pages 71-74

  Chunfei, Ye ^a   Yim, Tan Soon ^b   Erping, Lee ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Discontinuity; Electromagnetic compatibility; IC packaging; Microwave circuit design; Nonuniform transmission line

Indexed keywords

EID: 70350197837     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.1086     Document Type: Article

References (8)

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