Specific grain boundary resistivity measurements in thin film copper bicrystals

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 269-274

  Kulkarni, Nagraj S ^a,b   Evans, Boyd M ^b   Kim, Tae Hwan ^b   Li, An Ping ^b   Kenik, Edward A ^b   Nicholson, Don M ^b  

^a UNIVERSITY OF TENNESSEE   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER FILMS; CU FILMS; CU LINES; FIB MILLING; FOUR-PROBE STM; GRAIN BOUNDARY RESISTIVITY; ION IMPREGNATION; NANO SCALE; PROBE SPACING; REDEPOSITION;

BICRYSTALS; FOCUSED ION BEAMS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METALLIC FILMS; METALLIZING; MILLING (MACHINING); PROBES; SENSITIVITY ANALYSIS; THIN FILM DEVICES; THIN FILMS;

COPPER;

EID: 70349971360     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. W. Steinhögl, G. Schindler, G. Steinlesberger, M. Traving, and M. Engelhardt, "Comprehensive study of the resistivity of Cu wires with lateral dimensions of 100 nm and smaller," J. Appl. Phys. 97, 023706, 2005.
2. International Technology Roadmap for Semiconductors (ITRS), 2007 edition. W. Zhang, S. H. Brongersma, Z. Li, D. Li, O. Richard, and K. Maex, "Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity," J. Appl. Phys. 101, 063703, 2007.
3. T.-H. Kim, Z. Wang, J. F. Wendelken, H. Weitering, W. Li, and A.-P. Li, "A cryogenic Quadraprobe scanning tunneling microscope system with fabrication capability for nanotransport research," Rev. Sci. Instr. 78, 123701, 2007.
4. Y.-C. Joo and C. V. Thompson, "Analytical model for the grain structures of near-bamboo interconnects," J. Appl. Phys. 76, 7339, 1994.
5. I. Nakamichi, "Electrical Resisitivity and Grain Boundaries in Metals," Mat. Sci. For. 207-209, 47, 1996.
6. R. A. Brown, "A dislocation model of grain boundary electrical resistivity," J. Phys.F: Metal Phys. 7, No.8, 1477, 1977.
7. P. V. Andrews, M. B. West, and C. R. Robeson, "The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminium," Phil. Mag. 19:161, 887, 1969.