Novel and production-worthy wafer-on-a-wafer (WOW) technology using self-aligned TSV (SALT) interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 501-505

  Maeda, Nobuhide ^a   Kitada, Hideki ^a   Fujimoto, Koji ^b   Suzuki, Kosuke ^b   Nakamura, Tomoji ^c   Ohba, Takayuki ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b DAI NIPPON PRINTING CO LTD   (Japan)

^c FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; BULK SILICON; BUMP BONDING; CONVENTIONAL METALS; ELECTRICAL FAILURES; GRINDING PROCESS; INTEGRATION PROCESS; METAL CONTAMINATION; ON-WAFER; SELF-ALIGNED;

METALLIZING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

WAFER BONDING;

EID: 70349904599     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. K. Chen, et al, Proc. IEDM2006 (2006) 367.
2. C. Bower, et al., Proc. ECTC2006 (2006) 399.
3. R. Labie, et al, Proc. IITC2008 (2008) 19.