The effects of deformation conditions on microstructure and texture of commercially pure Ti

Acta Materialia

Volumn 57, Issue 19, 2009, Pages 5822-5833

  Zeng, Zhipeng ^a,b   Jonsson, Stefan ^a   Roven, Hans Jørgen ^c  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b ADVANCED MANUFACTURE TECHNOLOGY CENTER   (China)

^c NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

Author keywords

CP Ti; EBSD; Hot compression; Schmid factor; Texture

Indexed keywords

BASAL SLIP; COMPRESSION DIRECTIONS; CP TI; DEFORMATION CONDITIONS; DEFORMED GRAINS; EBSD; ELECTRON BACK-SCATTERED DIFFRACTION; FIBER TEXTURE; FREQUENCY-DISTRIBUTION; HEAVY DEFORMATION; HOT COMPRESSION; HOT COMPRESSION TESTS; KEY FACTORS; MIS-ORIENTATION; PYRAMIDAL SLIP SYSTEMS; SCHMID FACTOR; SCHMID FACTORS; SECOND ORDERS; SLIP SYSTEM; SUBGRAIN SIZES; TEXTURE COMPONENTS; TEXTURE EVOLUTIONS;

COMPRESSION TESTING; DEFORMATION; ELECTRON DIFFRACTION; SULFUR COMPOUNDS;

TEXTURES;

EID: 70349774364     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.08.016     Document Type: Article

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