Novel heat-resistant and organosoluble poly(amide-imide)s containing laterally-attached phenoxy phenylene groups

Polymer Degradation and Stability

Volumn 94, Issue 11, 2009, Pages 1991-1998

  Behniafar, Hossein ^a   Beit Saeed, Ali ^a   Hadian, Ahmad ^a  

^a ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

Differential scanning calorimetry; Heat stable polymer; Hinged poly(amide imide); Solubility

Indexed keywords

DIIMIDE-DIACIDS; DIPHENYL ETHER; FLEXIBLE THIN FILMS; GLACIAL ACETIC ACID; HEAT STABLE POLYMER; HINGED POLY(AMIDE-IMIDE); LOW CRYSTALLINITY; MAIN CHAINS; MODEL COMPOUND; NUMBER VALUES; ORGANOSOLUBLE; PHENYLENE GROUPS; POLAR SOLVENTS; QUALITATIVE STUDY; REFLUXING; SPECTRAL CHARACTERISTICS; THERMAL STABILITY; TRIPHENYL PHOSPHATE; WEIGHT-AVERAGE MOLECULAR WEIGHT; X-RAY DIFFRACTOGRAMS;

AMIDES; AMINES; AROMATIC COMPOUNDS; CHROMATOGRAPHIC ANALYSIS; DIFFERENTIAL SCANNING CALORIMETRY; FILM PREPARATION; MONOMERS; POLYCONDENSATION; POLYMERS; SOLUBILITY; TERNARY SYSTEMS; THERMODYNAMIC STABILITY;

ETHERS;

EID: 70349772951     PISSN: 01413910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymdegradstab.2009.07.016     Document Type: Article

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