SCOPUS 정보 검색 플랫폼

2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007

Volumn , Issue , 2007, Pages 33-36

Carrier techniques for thin wafer processing

(3) Landesberger, C a Scherbaum, S a Bock, K a

Author keywords

Mobile electrostatic carriers; Reversible bonding; Thin wafer processing; Wafer handling

Indexed keywords

CARRIER TECHNOLOGY; CMOS IMAGE SENSOR; ELEVATED TEMPERATURE; REVERSIBLE BONDING; TECHNICAL CAPABILITIES; THIN SILICON WAFER; THIN WAFERS; WAFER HANDLING;

ELECTROSTATICS; SOLDERING; WAFER BONDING;

SILICON WAFERS;

EID: 70349697078 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (17)

References (8)

1
- 84887465596
- Semiconductor International, January
- S. Pargfrieder, P. Lindner, G. Mittendorfer, J. Weixlberger; Ultrathin Wafer Processing Using Temporary Bonding; Semiconductor International, January 2006.
- (2006) Ultrathin Wafer Processing Using Temporary Bonding
- Pargfrieder, S.¹ Lindner, P.² Mittendorfer, G.³ Weixlberger, J.⁴

2
- 84887414837
- Workshop "Thin Semiconductor D November, Munich, Germany
- C. Kessel, K. Saito, F. Weimar; Wafer Thinning by using 3M Wafe Support System; Workshop "Thin Semiconductor D November 2006, Munich, Germany.
- (2006) Wafer Thinning by Using 3M Wafe Support System
- Kessel, C.¹ Saito, K.² Weimar, F.³

3
- 84887337959
- Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers
- New Orleans, Louisiana, April
- K. Bock, C. Landesberger, M. Bleier, D. Bollmann, D. Hemmetzberger, Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers", International Conference on Compound Semiconductor Manufacturing Technology "GaAs Mantech", New Orleans, Louisiana, April 2005.
- (2005) International Conference on Compound Semiconductor Manufacturing Technology "GaAs Mantech
- Bock, K.¹ Landesberger, C.² Bleier, M.³ Bollmann, D.⁴ Hemmetzberger, D.⁵

4
- 84887478498
- Handling and processing of thin semiconductor substrates by means of mobile electrostatic carriers
- Semicon Europa, Munich, Germany
- C. Landesberger, D. Bollmann, A. Drost, U. Schaber, K. Bock; Handling and processing of thin semiconductor substrates by means of mobile electrostatic carriers; International MEMS/MST Industry Forum, Semicon Europa 2006, Munich, Germany.
- (2006) International MEMS/MST Industry Forum
- Landesberger, C.¹ Bollmann, D.² Drost, A.³ Schaber, U.⁴ Bock, K.⁵

5
- 10444247340
- The challenge of ultra thin chip assembly
- Las Vegas, Nevada, USA
- M. Feil, C. Adler, D. Hemmetzberger, M. König, K. Bock; The Challenge of Ultra Thin Chip Assembly; Electronics Components and Technology Conference, 2004, Las Vegas, Nevada, USA.
- (2004) Electronics Components and Technology Conference
- Feil, M.¹ Adler, C.² Hemmetzberger, D.³ König, M.⁴ Bock, K.⁵

6
- 84887473374
- Backside thinned Si-image sensors in UHV devices
- November, Munich, Germany; see
- F. Robert, D. Tomuta, J. van Spijker, C. Kallmayer, C. Landesberger; Backside thinned Si-image sensors in UHV devices; Workshop "Thin Semiconductor Devices", November 2006, Munich, Germany; see:www.be-flexible.de.
- (2006) Workshop "Thin Semiconductor Devices
- Robert, F.¹ Tomuta, D.² Spijker, J.V.³ Kallmayer, C.⁴ Landesberger, C.⁵

7
- 84887420669
- US patent US 7, 027, 283 B2
- US patent US 7, 027, 283 B2.

8
- 84887449141
- German patent application DE 10 2004 021 259 A1
- German patent application DE 10 2004 021 259 A1.

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