MICROFAB DVF 200: A fast, robust, electrochemical process for thru silicon vias applications

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 119-123

  Richardson, Thomas B ^a   Wang, Chen ^a   Rietmann, Christian ^a   Wang, Cai ^a   Ye, Pingping ^a   Chung, Stream ^a   Zhang, Yun ^a   Abys, Joe ^a  

^a Assembly Materials Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL PROCESS; ELECTROPLATING PROCESS; GRAIN ORIENTATION; MATERIAL PROPERTY; MICROSCOPIC LEVELS; POWER EFFICIENCY; SPEED REQUIREMENT; STACKING TECHNOLOGY;

EXHIBITIONS;

EID: 70349694995     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Eric Mounier, Market Drivers for 3D Integration, SEMICON West 2007, July 2007.
2. Y. Zhang and S. Chung, Defect Free TSV Fill with Minimum Overburden, IMAPS Device Packaging Conference, March 2007.