Design of compact power divider using integrated passive device (IPD) technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1894-1899

  Kim, Hyun Tai ^a   Liu, Kai ^b   Frye, Robert C ^c   Lee, Yong Taek ^a   Kim, Gwang ^a   Ahn, Billy ^a  

^a STATS CHIPPAC LTD   (Singapore)

^b STATS ChipPAC Ltd   (United States)

^c RF Design Consulting LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC SIMULATION; FLIP CHIP; INDUCTOR DESIGN; INTEGRATED PASSIVE DEVICE; ISOLATION CHARACTERISTICS; LOWER COST; POWER DIVIDER; QUALITY FACTORS; RADIO FREQUENCY DEVICES; RETURN LOSS; SILICON SUBSTRATES; TECHNOLOGY-BASED; WIRE BONDS; WIRELESS COMMUNICATION SYSTEM; WIRELESS SYSTEMS;

BANDPASS FILTERS; CELLULAR TELEPHONE SYSTEMS; COMMUNICATION SYSTEMS; FLIP CHIP DEVICES; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; MOBILE COMPUTING; WIRE;

TECHNOLOGY;

EID: 70349670703     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074278     Document Type: Conference Paper

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