Electroplating copper filling for 3d packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 648-653

  Nagai, Mizuki ^a   Tamari, Yusuke ^a   Saito, Nobutoshi ^a   Kuriyama, Fumio ^a   Fukunaga, Akira ^a   Owatari, Akira ^a   Masashi, Shimoyama ^a   Moore, Catherine ^b  

^a EBARA CORPORATION   (Japan)

^b Ebara Technologies Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

300 MM WAFERS; 3D PACKAGING; CU ELECTROPLATING; DEPOSITION POTENTIAL; DIP-TYPE; HIGH-ASPECT RATIO; ORGANIC ADDITIVES; PLATING SOLUTIONS; PLATING SYSTEMS; SOLUTION FLOW RATE; SOLUTION FLOWS; VIA FILLING;

ADDITIVES; ASPECT RATIO; ELECTROPLATING; TECHNOLOGY;

FILLING;

EID: 70349653040     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074082     Document Type: Conference Paper

References (8)

1. th European Microelectronics & Packaging Conference and Exhibition, 2003.
2. th ECTC, pp. 466-471, 2004.
3. rd ECTC Symp., 2003.
4. N.Saito, R.Kiumi, F.Kuriyama, "Electroplating of Cu through electrodes in 3D packaging", Proc. of the International Wafer Level Packaging Congress 2005, pp.128-133, 2005.
5. th Spring Meeting of the JAPRS, 28a-ZK-2, pp. 867, 2008.
6. F.Kuriyama, A.Fukunaga, A.Owatari, N.Saito, M.Nagai, "Electroplating Copper Filling for 3-D Packaging", Proc. of the ICEP2008, pp.489-492, 2008.
7. th Micro- Electronics Symposium, pp.109-112, 2004.
8. th Meeting of the SFJ., pp.45, 2006.