Highly-reliable molecular-pore-stack (MPS)-SiOCH/Cu interconnects with CoWB metal-cap films

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 11-13

  Tagami, M ^a   Furutake, N ^a   Inoue, N ^a   Nakazawa, E ^b   Arita, K ^b   Hayashi, Y ^a  

^a LSI Fundamental Research Laboratory   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON RICH; CLOSED PORE; CO DIFFUSION; CU-INTERCONNECTS; MATRIX; METAL RESIDUES; SELF-ALIGNED; SIOC-H FILM;

COBALT; MAGNETOPLASMA; OPTICAL INTERCONNECTS; SURFACE DIFFUSION;

METALS;

EID: 70349590796     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090327     Document Type: Conference Paper

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