Three-dimensional thermal buckling analysis of piezoelectric antisymmetric angle-ply laminates using finite layer method

Composite Structures

Volumn 92, Issue 1, 2010, Pages 31-38

  Akhras, G ^a   Li, W C ^a  

^a ROYAL MILITARY COLLEGE OF CANADA   (Canada)

Author keywords

Antisymmetric angle ply; Finite layer method; Piezoelectric laminates; Thermal buckling; Thermal, electric and mechanical coupling; Three dimensional analysis

Indexed keywords

ANTISYMMETRIC ANGLE-PLY; FINITE LAYER METHOD; PIEZOELECTRIC LAMINATES; THERMAL BUCKLING; THERMAL, ELECTRIC AND MECHANICAL COUPLING; THREE DIMENSIONAL ANALYSIS;

LAMINATES; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; STIFFNESS MATRIX; TEMPERATURE; THREE DIMENSIONAL;

BUCKLING;

BUCKLING; COMPUTER SIMULATION; COUPLING; LAMINATE; MATHEMATICAL ANALYSIS; MATHEMATICAL MODEL; STIFFNESS; STRESS; TEMPERATURE;

EID: 70349466652     PISSN: 02638223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compstruct.2009.06.010     Document Type: Article

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