Thin low-k SiOC(N) dielectric /ruthenium stacked barrier technology

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 203-205

  Tarumi, Nobuaki ^a   Oda, Noriaki ^a   Kondo, Seiichi ^a   Ogawa, Shinichi ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER LAYERS; BARRIER PROPERTIES; BARRIER TECHNOLOGIES; DEPOSITION PROCESS; MOISTURE DIFFUSION; PHYSICAL SPUTTERING; SIOC FILM; STACK STRUCTURE;

DIELECTRIC FILMS; RUTHENIUM; TANTALUM COMPOUNDS;

COPPER;

EID: 70349464959     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090388     Document Type: Conference Paper

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