Enabling 3D interconnects with metal direct bonding

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 152-154

  Cioccioa, Léa Di ^a   Gueguena, Pierric ^a   Signamarcheixa, Thomas ^a   Rivoire, Maurice ^b   Scevola, D ^b   Cahours, Régis ^b   Leduca, Patrick ^a   Assousa, M ^a   Claveliera, Laurent ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3-D INTERCONNECTS; AMBIENT AIR; DIRECT BONDING; HIGH DENSITY; KEY TECHNOLOGIES; ROOM TEMPERATURE;

ATMOSPHERIC PRESSURE; TUNGSTEN;

THREE DIMENSIONAL;

EID: 70349445569     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090369     Document Type: Conference Paper

References (9)

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9. K. N. Chen et al el.dev.lett vol. 25 n°1 (2004).