High resistive ferrite films by a solution process for electromagnetic compatible (EMC) devices

Journal of Magnetism and Magnetic Materials

Volumn 321, Issue 24, 2009, Pages 3979-3983

  Subramani, A K ^a   Kondo, K ^b   Tada, M ^a   Abe, M ^a   Yoshimura, M ^a   Matsushita, N ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b NEC TOKIN CORPORATION   (Japan)

Author keywords

Ferrite film; Magnetic material; Resistivity; Solution process

Indexed keywords

CHEMICAL COMPOSITIONS; FERRITE FILM; FERRITE FILMS; FERRITE PLATING; HIGH RESISTIVITY; MEASUREMENT FREQUENCY; MN-ZN FERRITES; NOISE SUPPRESSING; NOISE SUPPRESSORS; REFLECTION AND TRANSMISSION COEFFICIENTS; REFLOW--SOLDERING; RESISTIVITY; SINGLE-PHASE SPINEL STRUCTURE; SOLUTION PROCESS; SPIN SPRAY; STOPBAND FREQUENCY;

FERRITE; FLIP CHIP DEVICES; HEAT TREATMENT; MAGNETIC DEVICES; MAGNETIC MATERIALS; MAGNETOELECTRIC EFFECTS; MANGANESE; MANGANESE COMPOUNDS; SOLDERING; THERMAL EFFECTS; ZINC;

FILM PREPARATION;

EID: 70349232767     PISSN: 03048853     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmmm.2009.07.036     Document Type: Article

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