Wireless activity monitor using 3D integration

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 86-91

  Van Doremalen, Ric ^a   Van Engen, Piet ^a   Jochems, Wouter ^a   Rommers, Ad ^a   Maas, Geert ^a   Cheng, Shi ^b   Rydberg, Anders ^b   Fritzsch, Thomas ^c   Wolf, Jürgen ^c   De Raedt, Walter ^d   Jansen, Roelof ^d   Müller, Philippe ^d   Alarcon, Eduardo ^a   Sanduleanu, Mihai ^a,e  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b UPPSALA UNIVERSITY   (Sweden)

^c Fraunhofer Institute Reliability and Microintegration   (Germany)

^d IMEC   (Belgium)

^e IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BODY PARAMETERS; COMMUNICATION DEVICE; CONTINUOUS MEASUREMENTS; DESIGN CONSIDERATIONS; E-CUBES; EUROPEAN PROJECT; FUNCTIONAL LAYER; INTEGRATED DESIGNS; INTEGRATED PASSIVES; OXYGEN LEVELS; POWER DATA; REDISTRIBUTION LAYERS; SILICON SUBSTRATES; SMALL ANTENNA; TRAINING PROGRAM; WIRELESS SENSOR;

ANTENNAS; DATA TRANSFER; INTERNET PROTOCOLS; OXYGEN; PATIENT MONITORING; PATIENT REHABILITATION; POLYCHLORINATED BIPHENYLS; SENSORS; TRANSMITTERS;

DESIGN;

EID: 70349208929     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)