Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 292-299

  Hahn, Robert ^a   Marquardt, Krystan ^a   Blechert, Martin ^b   Lehmann, Marco ^b   Töpper, Michael ^a   Wilke, Martin ^a   Semionyk, Peter ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BATTERY LIFETIME; BONDING PARAMETERS; CAPACITY REDUCTION; CONTACT PADS; DEEP CAVITY; ELECTRICAL CONTACTS; ELECTRICAL TESTS; ENERGY DENSITY; GLASS SUBSTRATES; HERMETIC PACKAGING; LITHIUM MICRO-BATTERY; LITHIUM POLYMER BATTERIES; MEMSDEVICES; MICRO BATTERY; ON-WAFER; SHEAR FORCE; SILICON CHIP; UV-CURABLE EPOXIES; WATER PERMEATION RATE;

CATALYST ACTIVITY; LITHIUM; SEALING (CLOSING); SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 70349207507     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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