Thermal sensor allocation and placement for reconfigurable systems

ACM Transactions on Design Automation of Electronic Systems

Volumn 14, Issue 4, 2009, Pages

  Lee, Byunghyun ^a   Chung, Ki Seok ^b   Koo, Bontae ^c   Eum, Nak Woong ^c   Kim, Taewhan ^a  

^a Seoul National University   (South Korea)

^b Hanyang University   (South Korea)

^c Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

Optimal placement; Reconfigurable system; Thermal sensor; Unate covering problem

Indexed keywords

APPLICATION LOGIC; COVERING PROBLEMS; DESIGN ISSUES; DYNAMIC MONITORING; EFFECTIVE SOLUTION; GRID-BASED; HARDWARE RESOURCES; HOTSPOTS; MANUFACTURING STAGES; OPTIMAL PLACEMENT; PLACEMENT PROBLEMS; PROGRAMMABLE LOGIC ARRAY; RECONFIGURABLE LOGIC; RECONFIGURABLE SYSTEM; RECONFIGURABLE SYSTEMS; SENSOR ALLOCATION; SENSOR IMPLEMENTATION; TARGET APPLICATION; TEMPERATURE CORRELATION; THERMAL BEHAVIORS; THERMAL PROFILES; THERMAL SENSOR; THERMAL SENSORS; UNATE-COVERING PROBLEM;

STRUCTURAL DESIGN;

SENSORS;

EID: 70349144442     PISSN: 10844309     EISSN: 15577309     Source Type: Journal    
DOI: 10.1145/1562514.1562518     Document Type: Article

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