Biomedical implant transceiver with novel multi level LSK back telemetry and fully digital BPSK demodulation

Proceedings of the IEEE Annual Northeast Bioengineering Conference, NEBEC

Volumn , Issue , 2009, Pages

  Xu, Wangren ^a   Luo, Zhenying ^a   Sonkusale, Sameer ^a  

^a TUFTS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARTS COMPUTING; DEMODULATION; DEMODULATORS; ELECTRIC POWER UTILIZATION; SILICON IMPLANTS; TELEMETERING EQUIPMENT; TRANSCEIVERS;

BINARY PHASE-SHIFT KEYING DEMODULATORS; BIOMEDICAL IMPLANTS; DIGITAL ARCHITECTURE; DISCRETE COMPONENTS; LOAD IMPEDANCE; LOW-POWER CONSUMPTION; MULTI-LEVEL LOAD; SIMULATIONS AND MEASUREMENTS;

BINARY PHASE SHIFT KEYING;

EID: 70349105066     PISSN: 1071121X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEBC.2009.4967630     Document Type: Conference Paper

References (2)

1. P.R. Troyk, I.E. Brown, W.H. Moore and G. E. Loeb, "Development of BION™ technology for functional electrical stimulation: bidirectional telemetry", Proc. 23rd Intl. IEEE/EMBS Conf., vol.2, pp. 1317-1320, Oct. 2001.
2. W. Liu et al., "A neuro-stimulus chip with telemetry unit for retinal prosthetic device," IEEE J. Solid-State Cir., vol.35, pp. 1487-1497, Oct. 2000.