On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

Radiation Measurements

Volumn 44, Issue 5-6, 2009, Pages 548-553

  Woda, Clemens ^a   Spöttl, Thomas ^b  

^a INSTITUTE OF EPIDEMIOLOGY   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Accident dosimetry; Chip card module; Fortuitous dosimeter; OSL; Silica

Indexed keywords

A-THERMAL; ACCIDENT DOSIMETRY; CHIP CARD MODULE; CHIP CARDS; CREDIT CARDS; CURED EPOXY; DOSE RESPONSE; FORTUITOUS DOSIMETER; LUMINESCENCE PROPERTIES; MEASURED SIGNALS; OPTICALLY STIMULATED LUMINESCENCE; OSL; PRE-HEAT TREATMENT; PRE-TREATMENT; RADIATION SENSITIVITY; RECOVERY TEST; ROOM TEMPERATURE; SATURATION DOSE; SILICA GRAINS; THERMAL DECAYS; THERMO-OPTICAL; THIXOTROPIC PROPERTIES; WIREBOND;

ACCIDENTS; DOSIMETRY; HEALTH INSURANCE; LUMINESCENCE; OPTICAL PROPERTIES; SILICA; WIRE;

DOSIMETERS;

EID: 70249148024     PISSN: 13504487     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.radmeas.2009.02.016     Document Type: Article

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