Three-dimensional thermal analysis for Laser assisted machining of ceramics using FEA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7282, Issue , 2009, Pages

  Wu, Xuefeng ^a   Zhang, Hongzhi ^a   Wang, Yang ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Ceramics; Finite element analysis; Laser assisted machining; Thermal stress

Indexed keywords

AVERAGE TEMPERATURE; CALCULATING TIME; CERAMICS; CONVECTIVE HEAT TRANSFER; CUTTING DEPTH; EXPERIMENT SYSTEM; FAILURE CRITERIA; FEED-RATES; FINITE ELEMENT ANALYSIS; HEAT TRANSFER MODEL; HIGH TEMPERATURE GRADIENT; LASER ASSISTED MACHINING; LASER POWER; MATERIAL REMOVAL; OPERATING PARAMETERS; OPERATION PARAMETERS; RADIATION EXCHANGE; ROTATIONAL SPEED; TEMPERATURE DEPENDENT; THERMAL ANALYSIS; THERMAL PROCESS; THERMO-PHYSICAL PROPERTY; WORK PIECES;

CERAMIC MATERIALS; CUTTING TOOLS; HEAT EXCHANGERS; HEAT TRANSFER; HIGH POWER LASERS; LASER BEAM CUTTING; LASER BEAM EFFECTS; LASER HEATING; LASERS; MACHINING; MANUFACTURE; SILICON NITRIDE; TECHNOLOGY; TESTING; THERMAL STRESS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELASTICITY; THREE DIMENSIONAL;

FINITE ELEMENT METHOD;

EID: 69949157349     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.830988     Document Type: Conference Paper

References (7)

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7. Shen X, Liu W J, Lei S. Three-dimensional thermal analysis for Laser assisted milling of silicon nitride ceramics using FEA. Orlando, FL, United States: American Society of Mechanical Engineers, New York, United States, 2005.