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Volumn 7470, Issue , 2009, Pages
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Sub-30 nm defect removal on EUV substrates
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Author keywords
EUVL; Mask blank defects; Sub 30 nm defects cleaning
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Indexed keywords
AFM;
ATOMIC FORCE MICROSCOPES;
CHEMICAL-MECHANICAL POLISHING PROCESS;
CLEANING CYCLES;
CLEANING PROCESS;
DEFECT REDUCTION;
EMBEDDED PARTICLES;
EUVL;
GLASS POLISHING;
HARD PARTICLES;
LATEX SPHERES;
LOW THERMAL EXPANSION MATERIALS;
MASK BLANK DEFECTS;
NATURALLY OCCURRING;
PARTICLE REMOVAL;
PARTICLE REMOVAL EFFICIENCY;
SOFT PARTICLES;
SUB 30 NM DEFECTS CLEANING;
ATOMIC FORCE MICROSCOPY;
CHEMICAL MECHANICAL POLISHING;
CHEMICAL POLISHING;
EXTREME ULTRAVIOLET LITHOGRAPHY;
GLASS;
OXIDE MINERALS;
PARTICLE SIZE;
PARTICLES (PARTICULATE MATTER);
POLISHING;
QUARTZ;
REMOVAL;
STYRENE;
SUBSTRATES;
THERMAL EXPANSION;
SURFACE DEFECTS;
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EID: 69949121372
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.835197 Document Type: Conference Paper |
Times cited : (2)
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References (3)
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