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Volumn 914, Issue , 2006, Pages
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Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
AMORPHOUS INTER-LAYER DIELECTRICS;
COPPER ELECTRODEPOSITS;
GRAIN BOUNDARY GROOVING;
NANOMETRIC DIMENSIONS;
CHARACTERIZATION;
COMPUTER SIMULATION;
DIELECTRIC MATERIALS;
ELASTIC MODULI;
FRACTURE;
OPTICAL PROPERTIES;
THERMAL CONDUCTIVITY;
THIN FILMS;
ULTRAVIOLET RADIATION;
COPPER;
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EID: 69649108454
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Review |
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Times cited : (2)
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References (0)
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