Reduction in eddy current loss in conductor using magnetoplated wire

IEEJ Transactions on Fundamentals and Materials

Volumn 127, Issue 10, 2007, Pages

  Mizuno, Tsutomu ^a   Suzuki, Takayuki ^a   Asahina, Takashi ^a   Noda, Masahiro ^a   Enoki, Shigemi ^b   Shinagawa, Hiroki ^b   Uehara, Seisaku ^c   Kitazawa, Hiroshi ^c  

^a SHINSHU UNIVERSITY   (Japan)

^b Shinkawa Sensor Technology Inc   (Japan)

^c Totoku Electric Co Ltd   (Japan)

Author keywords

Alternating field; Copper wire; Eddy current loss; Expression; Finite element method; Magnetoplated wire; Skin effect

Indexed keywords

ANALYSIS TIME; BROKEN DOWN; COIL RESISTANCE; COPPER WIRE; COPPER WIRES; DC RESISTANCE; EDDY CURRENT-LOSS; EXPRESSION; HIGH FREQUENCY HF; MEMORY CAPACITY; PROXIMITY EFFECTS;

COPPER; EDDY CURRENTS; ELECTRIC CONDUCTORS; FINITE ELEMENT METHOD; MAGNETIC THIN FILMS; SKIN; SKIN EFFECT;

WIRE;

EID: 69649103775     PISSN: 03854205     EISSN: 13475533     Source Type: Journal    
DOI: 10.1541/ieejfms.127.611     Document Type: Article

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