Engineering a material for biomedical applications with electric field assisted processing

Applied Physics A: Materials Science and Processing

Volumn 97, Issue 1, 2009, Pages 31-37

  Ahmad, Z ^a   Nangrejo, M ^a   Edirisinghe, M ^a   Stride, E ^a   Colombo, P ^a,b,c   Zhang, H B ^d  

^a UNIVERSITY COLLEGE LONDON   (United Kingdom)

^b UNIVERSITY OF PADOVA   (Italy)

^c PENNSYLVANIA STATE UNIVERSITY   (United States)

^d EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

3D STRUCTURE; APPLIED ELECTRIC FIELD; ASSISTED PROCESSING; BIOMEDICAL APPLICATIONS; DIRECT WRITE; ENCAPSULATED MATERIALS; FIBROUS NETWORKS; IN-SITU; LAB-ON-A-CHIP DEVICES; MICRO-FLUIDIC DEVICES; MULTI-LAYERED; NANO METER RANGE; NOVEL STRUCTURES; STATES OF MATTER; STRUCTURAL MORPHOLOGY; SURFACE MODIFICATION;

BIOLOGICAL MATERIALS; DRUG DELIVERY; ELECTRIC FIELDS; ENCAPSULATION;

TISSUE ENGINEERING;

EID: 69549116112     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-009-5359-z     Document Type: Article

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