Effects of mould filling on evolution of the solid-liquid interface during solidification

Applied Thermal Engineering

Volumn 29, Issue 17-18, 2009, Pages 3669-3678

  Pathak, Nitin ^a   Kumar, Arvind ^a   Yadav, Anil ^a   Dutta, Pradip ^a  

^a INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Filling; Residual flow; Solidification; Volume of fluid

Indexed keywords

BUOYANCY DRIVEN FLOWS; COMPUTATIONAL FLUID DYNAMICS CODES; CONTROL VOLUMES; COOLING RATES; COUPLED EFFECT; FILLING PROCESS; FREE-SURFACE FLOW; MOULD FILLING; PARAMETRIC STUDY; PHASE CHANGE; RECTANGULAR CAVITY; RESIDUAL FLOW; SOLID-LIQUID INTERFACES; SOLIDIFICATION INTERFACE; SOLIDIFICATION MODELING; TEMPERATURE GRADIENT; USER DEFINED FUNCTIONS; VOLUME OF FLUID; VOLUME OF FLUIDS;

BUOYANCY; COMPUTATIONAL FLUID DYNAMICS; COOLING; CRYSTALLIZATION; FILLING; FLUIDS; MOLDS; SOLIDIFICATION; TWO DIMENSIONAL;

PHASE INTERFACES;

EID: 69449093924     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2009.06.026     Document Type: Article

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