Effect of low-temperature shock compression on the microstructure and strength of copper

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 35 A, Issue 9, 2004, Pages 2729-2739

  Lassila, David H ^a   Shen, Tien ^a   Cao, Bu Yang ^b   Meyers, Marc A ^b  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTING; DISLOCATIONS (CRYSTALS); GRAIN SIZE AND SHAPE; LOW TEMPERATURE EFFECTS; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); STRAIN HARDENING; STRENGTH OF MATERIALS;

SHOCK COMPRESSION; STRESS STRAIN RESPONSE; THERMODYNAMIC CALCULATION; WORK SOFTENING;

COPPER;

EID: 6944225396     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-004-0219-0     Document Type: Article

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