Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 967-971

  Held, Marcel ^a   Fritz, Klaus ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b Diehl Aerospace GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC; CONTROL UNIT; ELECTRONIC COMPONENT; FAILURE RATE; FIELD DATA; PREDICTION MODEL; TEMPERATURE CYCLES;

AVIONICS;

MATHEMATICAL MODELS;

EID: 69249213446     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.07.031     Document Type: Article

References (13)

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4. DIN EN IEC 61709. Electronic components - reliability - reference conditions for failure rates and stress models for conversion (emerged from Siemens Norm SN 29500); 1996.
5. IEC TR 62380. Reliability data handbook - universal model for reliability prediction of electronics components, PCBs and equipment (emerged from UTE C 80-810 or RDF 2000); 2004.
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7. Pecht M. Why the traditional reliability prediction models do not work - is there an alternative?. Electron Cooling 2 1 (1996)
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13. Handbook of 217Plus Reliability Prediction Models. RIAC; 2006.