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Volumn 57, Issue 16, 2009, Pages 4649-4657

Vacancy-driven stress relaxation in layers

Author keywords

Annihilation; Non equilibrium processes; Residual stresses; Substitutional diffusion; Vacancies

Indexed keywords

ANNIHILATION; DIFFUSIVITIES; EVOLUTION EQUATIONS; HYDROSTATIC STRESS; INTENSITY PARAMETERS; MULTI-COMPONENT DIFFUSION; NON-EQUILIBRIUM PROCESSES; NON-IDEAL SOURCES; NONLINEAR PARTIAL DIFFERENTIAL EQUATIONS; NONLINEAR TERMS; NUMERICAL SOLUTION; SOURCE AND SINK; SUBSTITUTIONAL DIFFUSION; THIN LAYERS; VACANCY SITES;

EID: 69049106814     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.06.016     Document Type: Article
Times cited : (21)

References (17)
  • 9
    • 69049113129 scopus 로고    scopus 로고
    • Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region
    • Brebbia C.A. (Ed), WIT Press, Wessex
    • Tsurkov I., Grich W.M., and Gross T.S. Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region. In: Brebbia C.A. (Ed). High performance structures and materials III (2006), WIT Press, Wessex 85
    • (2006) High performance structures and materials III , pp. 85
    • Tsurkov, I.1    Grich, W.M.2    Gross, T.S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.