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Volumn 255, Issue 22, 2009, Pages 8995-8999
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Stress distribution and hillock formation in Au/Pd thin films as a function of aging treatment in capacitor applications
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Author keywords
Au Pd thin film; Grain boundary scattering; Hillock formation
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Indexed keywords
BINARY ALLOYS;
ELECTRIC CONDUCTIVITY;
GOLD ALLOYS;
GRAIN BOUNDARIES;
PALLADIUM ALLOYS;
AGING TREATMENT;
DENSITY OF DISLOCATION;
GRAIN BOUNDARY SCATTERING;
HILLOCK FORMATION;
SUBSTRATE RELAXATION;
TRIPLE JUNCTION;
THIN FILMS;
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EID: 68649115703
PISSN: 01694332
EISSN: None
Source Type: Journal
DOI: 10.1016/j.apsusc.2009.06.077 Document Type: Article |
Times cited : (12)
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References (11)
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