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Volumn 21, Issue 3, 2009, Pages 24-29
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Composite coating structure in an implantable electronic device
a a a a
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
COATINGS TECHNOLOGY;
CONFORMAL COATINGS;
DESIGN/METHODOLOGY/APPROACH;
ELECTRONIC DEVICE;
EPOXY COATINGS;
EPOXY LAYERS;
FLIP CHIP;
FLIP CHIP JOINTS;
GAMMA STERILIZATION;
HUMIDITY TESTS;
PARYLENE C;
RELIABILITY TESTING;
RESEARCH RESULTS;
SCANNING ELECTRONS;
TEST SAMPLES;
COMPOSITE COATINGS;
EPOXY RESINS;
FAILURE ANALYSIS;
FLIP CHIP DEVICES;
MEDICAL APPLICATIONS;
MOISTURE;
RELIABILITY ANALYSIS;
SAFETY FACTOR;
SCANNING ELECTRON MICROSCOPY;
STERILIZATION (CLEANING);
TESTING;
QUALITY ASSURANCE;
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EID: 68249116093
PISSN: 09540911
EISSN: None
Source Type: Journal
DOI: 10.1108/09540910910970385 Document Type: Article |
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Times cited : (4)
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References (0)
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