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Volumn 21, Issue 3, 2009, Pages 10-15
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Edge tail length effect on reliability of DBC substrates under thermal cycling
a a a a a
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC LAYER;
CHABOCHE MODEL;
DESIGN/METHODOLOGY/APPROACH;
EDGE GEOMETRY;
HIGH TEMPERATURE;
HIGH-TEMPERATURE PACKAGING;
INTERFACE CRACK;
INTERFACE CRACKING;
PACKAGING SUBSTRATES;
PLASTIC STRAIN;
TAIL LENGTH;
THERMAL ANALYSIS;
THERMAL CRACKING;
THERMAL CYCLE;
THERMAL PROPERTIES;
THERMAL STRAIN;
THREE-POINT BENDING TEST;
CHIP SCALE PACKAGES;
COPPER;
CRACKING (CHEMICAL);
CRACKS;
MATERIALS PROPERTIES;
PACKAGING MATERIALS;
PLASTIC DEFORMATION;
PLASTICS;
THERMAL CYCLING;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
SUBSTRATES;
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EID: 68249094683
PISSN: 09540911
EISSN: None
Source Type: Journal
DOI: 10.1108/09540910910970367 Document Type: Article |
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Times cited : (31)
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References (0)
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