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Volumn 21, Issue 3, 2009, Pages 16-23
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Effect of substrate material and thickness on reliability of ACA bonded flip chip joints
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ANISOTROPIC CONDUCTIVE ADHESIVES;
BONDING PRESSURE;
BONDING PROCESS;
DESIGN/METHODOLOGY/APPROACH;
DIFFERENT SUBSTRATES;
EFFECT OF PRESSURE;
FAILURE MECHANISM;
FLIP CHIP JOINTS;
FR4 SUBSTRATES;
GLASS FIBRES;
RELIABILITY MANAGEMENT;
SUBSTRATE MATERIAL;
TEMPERATURE CYCLING TESTS;
TEST SAMPLES;
THERMAL CYCLING RELIABILITY;
ADHESIVE JOINTS;
ADHESIVES;
AUTOMOBILE SEATS;
DEFORMATION;
FLIP CHIP DEVICES;
GLASS BONDING;
GLASS FIBERS;
LIGHT SOURCES;
LIQUID CRYSTAL POLYMERS;
LIQUID CRYSTALS;
LIQUIDS;
PRESSURE EFFECTS;
RELIABILITY;
TESTING;
THERMAL CYCLING;
SUBSTRATES;
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EID: 68249085076
PISSN: 09540911
EISSN: None
Source Type: Journal
DOI: 10.1108/09540910910970376 Document Type: Article |
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Times cited : (19)
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References (0)
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