Scale-up of 2G wire manufacturing at American Superconductor Corporation

Physica C: Superconductivity and its Applications

Volumn 469, Issue 15-20, 2009, Pages 1316-1321

  Fleshler, S ^a   Buczek, D ^a   Carter, B ^a   Cedrone, P ^a   DeMoranville, K ^a   Gannon, J ^a   Inch, J ^a   Li, X ^a   Lynch, J ^a   Otto, A ^a   Podtburg, E ^a   Roy, D ^a   Rupich, M ^a   Sathyamurthy, S ^a   Schreiber, J ^a   Thieme, C ^a   Thompson, E ^a   Tucker, D ^a   Nagashima, K ^b   Ogata, M ^b  

^a AMERICAN SUPERCONDUCTOR CORPORATION   (United States)

^b Technical Research Institute   (Japan)

Author keywords

2G wire; Metal organic deposition (MOD); RABiTS; Wire manufacturing

Indexed keywords

2G WIRE; AMERICAN SUPERCONDUCTOR CORPORATIONS; ELECTRICAL PERFORMANCE; FUTURE DIRECTIONS; HTS STRIP; INDUSTRY STANDARDS; LAST STAGE; LOW COST MANUFACTURING; MANUFACTURING CAPABILITY; MANUFACTURING LINES; MANUFACTURING PROCESS; METAL ORGANIC DEPOSITION; METAL ORGANIC DEPOSITION (MOD); METALLIC FOILS; MULTIPLE WIRES; RABITS; REEL-TO-REEL PROCESSING; RESEARCH AND DEVELOPMENT; SCALE-UP; SECOND GENERATION; STRIP PROCESS; TEXTURED SUBSTRATES; THERMAL AND MECHANICAL PROPERTIES; VOLUME PRODUCTION;

ELECTRIC BATTERIES; ELECTRIC PROPERTIES; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE SUPERCONDUCTORS; LAMINATING; LOW TEMPERATURE PRODUCTION; MANUFACTURE; MECHANICAL PROPERTIES; MILITARY APPLICATIONS; ORGANOMETALLICS; STAINLESS STEEL; SUPERCONDUCTIVITY;

WIRE;

EID: 68149175043     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physc.2009.05.234     Document Type: Article

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