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Volumn 11, Issue 3, 2009, Pages 213-219

Effect of solvent removal on adhesive properties of simplified etch-and-rinse systems and on bond strengths to dry and wet dentin

Author keywords

Adhesive systems; Microtensile bond strength; Moisture degree; Solvents

Indexed keywords

ACETONE; ALCOHOL; BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; DENTIN BONDING AGENT; METHACRYLIC ACID DERIVATIVE; ONE STEP DENTIN BONDING SYSTEM; ONE-STEP DENTIN BONDING SYSTEM; OPTIBOND SOLO PLUS; RESIN; RESIN CEMENT; SINGLE BOND; SOLVENT; WATER;

EID: 68149134075     PISSN: 14615185     EISSN: 17579988     Source Type: Journal    
DOI: 10.3290/j.jad.a15627     Document Type: Article
Times cited : (53)

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