Solderability of bulk metallic glasses using lead-free solders

Materials Transactions

Volumn 50, Issue 6, 2009, Pages 1326-1329

  Nishikawa, Hiroshi ^a   Piromsarn, Krit Wong ^a   Abe, Hiroya ^a   Takemoto, Tadashi ^a   Fukuhara, Mikio ^b   Inoue, Akihisa ^b  

^a OSAKA UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Bulk metallic glass; Intermetallic compound; Lead free solder; Solderability; Ultrasonic soldering; Wetting behavior

Indexed keywords

BULK METALLIC GLASS; INTERMETALLIC COMPOUND; LEAD-FREE SOLDER; SOLDERABILITY; ULTRASONIC SOLDERING; WETTING BEHAVIOR;

BRAZING; GLASS; GLASS BONDING; LEAD; LEAD COMPOUNDS; LIQUID METALS; PALLADIUM; PLANNING; RESOURCE ALLOCATION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; ULTRASONICS; WELDING; WETTING; ZIRCONIUM;

METALLIC GLASS;

EID: 68149116196     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.ME200824     Document Type: Article

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