Molecular dynamics study of size, temperature and rate dependent thermomechanical properties of copper nanofilms

Mechanics Research Communications

Volumn 36, Issue 7, 2009, Pages 838-844

  Gan, Yong ^a   Chen, J K ^a  

^a University of Missouri   (United States)

Author keywords

Copper nanofilms; Extremely high loading rate; Molecular dynamics; Thermomechanical properties; Ultrafast pulsed laser

Indexed keywords

EXTREMELY HIGH LOADING RATE; HIGH LOADING RATE; MOLECULAR DYNAMICS SIMULATIONS; NANO FILMS; QUASI-STATIC; RATE DEPENDENT; ROOM TEMPERATURE; SOFTENING EFFECT; SURFACE PLASTICITY; THERMAL EXPANSION COEFFICIENTS; THERMO-MECHANICAL; THERMOMECHANICAL PROPERTIES; ULTRAFAST LASER HEATING; ULTRAFAST-PULSED LASER;

COPPER; DYNAMICS; LASER HEATING; LASERS; MOLECULAR DYNAMICS; PULSED LASER APPLICATIONS; THERMAL EFFECTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

STRAIN RATE;

EID: 68149103281     PISSN: 00936413     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechrescom.2009.05.004     Document Type: Article

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