Nanosecond Pulsed Plasma Dental Probe

Plasma Processes and Polymers

Volumn 6, Issue 8, 2009, Pages 479-483

  Jiang, Chunqi ^a   Chen, Meng Tse ^b   Gorur, Amita ^a   Schaudinn, Christoph ^a   Jaramillo, David E ^c   Costerton, J William ^a   Sedghizadeh, Parish P ^a   Vernier, P Thomas ^a   Gundersen, Martin A ^a  

^a UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^b Loma Linda University ^*  (United States)

^c LOMA LINDA UNIVERSITY   (United States)

Author keywords

Cold plasma; Dental disinfection; Plasma jet; Pulsed discharges; Sterilization

Indexed keywords

ACTIVE AGENTS; AMBIENT ATMOSPHERE; ATOMIC OXYGEN; AVERAGE POWER; BACTERICIDAL EFFECTS; COLD PLASMA; COLD PLASMAS; DENTAL DISINFECTION; ELECTRIC PULSE; ENDODONTIC TREATMENT; LOW-POWER CONSUMPTION; PLASMA EMISSION SPECTROSCOPY; PLASMA PLUMES; PLASMA TREATMENT; PULSED DISCHARGE; PULSED PLASMA; ROOT CANAL SYSTEM; ROOT CANALS; TOOTH SURFACE;

ATOMIC SPECTROSCOPY; DISINFECTION; EMISSION SPECTROSCOPY; HEATING; HYDRAULIC STRUCTURES; LEAKAGE (FLUID); OXYGEN; PLASMA ACCELERATORS; PLASMA APPLICATIONS; PLASMA JETS; PLASMAS; PROBES; SCANNING ELECTRON MICROSCOPY; SPACE PROBES; STERILIZATION (CLEANING);

ELECTRIC DISCHARGES;

EID: 67949110008     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200800133     Document Type: Article

References (29)

1. A. N. Bhoj, M. J. Kushner, J. Phys. D. Appl. Phys. 2007, 40, 6953.
2. Y. Akishev, M. Grushin, A. Napartovich, N. Trushkin, Plasmas Polym. 2002, 7, 261.
3. G. Borcia, C. A. Anderson, N. M. D. Brown, Plasma Sources Sci. T. 2005, 14, 259.
4. X. T. Deng, J. J. Shi, H. L. Chen, M. G. Kong, Appl. Phys. Lett. 2007, 90, 013903.
5. K. Lee, K. Paek, W. T. Ju, Y. Lee, J. Microbiol. 2006, 44, 269.
6. I. G. Brown, K. A. Bjornstad, E. A. Blakely, J. E. Galvin, O. R. Monteiro, S. Sangyuenyongpipat, Plasma Phys. Control Fusion 2003, 45, 547.
7. M. Vleugels, G. Shama, X. T. Deng, E. Greenacre, T. Brocklehurst, M. G. Kong, IEEE Trans. Plasma Sci. 2005, 33, 824.
8. R. E. Sladek, S. K. Filoche, C. H. Sissons, E. Stoffels, Lett. Appl. Microbiol. 2007, 45, 318.
9. R. E. Sladek, E. Stoffels, R. Walraven, P. J. A. Tielbeek, R. A. Koolhoven, IEEE Trans. Plasma Sci. 2004, 32, 1540.
10. M. Laroussi, X. Lu, Appl. Phys. Lett. 2005, 87, 113902.
11. M. Laroussi, C. Tendero, X. Lu, S. Alla, W. L. Hynes, Plasma Process. Polym. 2006, 3, 470.
12. J. L. Walsh, J. J. Shi, M. G. Kong, Appl. Phys. Lett. 2006, 88, 171501.
13. J. L. Walsh, M. G. Kong, Appl. Phys. Lett. 2006, 89, 231503.
14. E. Stoffels, A. J. Flikweert, W. W. Stoffels, G. M. W. Kroesen, Plasma Sources Sci. T. 2002, 11, 383.
15. E. Stoffels, I. E. Kieft, R. E. J. Sládek, L. J. M. van den Bedem, E. P. van der Laan, M. Steinbuch, Plasma Sources Sci. T. 2006, 15, S169.
16. Y. X. Duan, C. Huang, Q. S. Yu, IEEE Trans. Plasma Sci. 2005, 33, 328.
17. Q. S. Yu, C. Huang, F. H. Hsieh, H. Huff, Y. X. Duan, Appl. Phys. Lett. 2006, 88, 013903.
18. F. Kolb, A. A. H. Mohamed, R. O. Price, R. J. Swanson, A. Bowman, R. L. Chiavarini, M. Stacey, K. H. Schoenbach, Appl. Phys. Lett 2008, 92, 241501.
19. E. E. Kunhardt, IEEE Trans. Plasma Sci. 2000, 28, 189.
20. S. Kanazawa, M. Kogoma, T. Moriwaki, S. Okazaki, J. Phys. D. Appl. Phys. 1988, 21, 838.
21. M. Laroussi, I. Alexeff, J. P. Richardson, F. F. Dyer, IEEE Trans. Plasma Sci. 2002, 30, 158.
22. J. Goree, L. Bin, D. Drake, E. Stoffels, IEEE Trans. Plasma Sci. 2006, 34, 1317.
23. K. H. Schoenbach, R. Verhappen, T. Tessnow, F. E. Peterkin, W. W. Byszewski, Appl. Phys. Lett. 1996, 68, 13.
24. R. H. Stark, K. H. Schoenbach, Appl. Phys. Lett. 1999, 74, 3770.
25. R. H. Stark, K. H. Schoenbach, ; Appl. Phys. 2001, 89, 3568.
26. J. L. Walsh, J. J. Shi, M. G. Kong, Appl. Phys. Lett. 2006, 89, 161505.
27. M. Laroussi, IEEE Trans. Plasma Sci. 2002, 30, 1409.
28. E. Stoffels, I. E. Kieft, R. E. J. Sladek, L. J. M. van den Bedem, E. P. van der Laan, M. Steinbuch, Plasma Sources Sci. T. 2006, 15, S169.
29. D. A. Mendis, M. Rosenberg, F. Azam, IEEE Trans. Plasma Sci. 2000, 28, 1304.