Analysis and elimination of the 'skip contact' phenomenon in an inertial micro-switch for prolonging its contact time

Journal of Micromechanics and Microengineering

Volumn 19, Issue 4, 2009, Pages

  Yang, Zhuoqing ^a   Ding, Guifu ^a   Cai, Haogang ^a   Xu, Xiaoxue ^b   Wang, Hong ^a   Zhao, Xiaolin ^a  

^a Shanghai Jiao Tong University   (China)

^b HARBIN ENGINEERING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAY OF CANTILEVERS; BRIDGE-TYPE; CONTACT PHENOMENA; CONTACT PROCESS; CONTACT TIME; DYNAMIC CONTACTS; HALF-SINE WAVES; PROOF MASS; RIGID SUBSTRATES; SHOCK ACCELERATION; SURFACE MICROMACHINING TECHNOLOGY; SWITCH CONTACTS;

MICROMACHINING; NANOCANTILEVERS;

ELECTRODES;

EID: 67849106623     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/4/045017     Document Type: Article

References (22)

1. Michaelis S, Timme H-J, Wycisk M and Binder J 2000 Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications J. Micromech. Microeng. 10 120-3
2. Zimmermann L, Ebersohl J Ph, Le Hung F, Berry J P, Baillieu F, Rey P, Diem B, Renard S and Caillat P 1995 Airbag application: a microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability Sensors Actuators A 1-3 190-5
3. Tønnesen T, Lüdtke O, Noetzel J, Binder J and Mader G 1997 Simulation, design and fabrication of electroplated acceleration switches J. Micromech. Microeng. 7 237-9
4. Wycisk M, Tönnesen T, Binder J, Michaelis S and Timme H-J 2000 Low-cost post-CMOS integration of electroplated microstructures for inertial sensing Sensors Actuators A 1-3 93-100
5. Frobenius W D, Zeitman S A, White M H, O'Sullivan D D and Hamel R G 1972 Microminiature ganged threshold accelerometers compatible with integrated circuit technology IEEE Trans. Electron Devices 1 37-40
6. Zavracky P M, Majumder S and McGruer N E 1997 Micromechanical switches fabricated using nickel surface micromachining J. Microelectromech. Syst. 1 3-9
7. Hsu T-R 2002 MEMS and Microsystems: Design and Manufacture (Beijing: McGraw-Hill) pp 56-9
8. Kovacs G T A 1998 Micromachined Transducers Sourcebook (Beijing: McGraw-Hill) pp 163-9
9. Hyman D and Mehregany M 1999 Contact physics of gold microcontacts for MEMS switches IEEE Trans. Compon. Packag. Technol. 3 357-64
10. Decuzzi P and Srolovitz D J 2004 Scaling laws for opening partially adhered contacts in MEMS J. Microelectromech. Syst. 2 377-85
11. Massad J E, Sumail H, Epp D S and Dyck C W 2005 Modeling, simulation, and testing of the mechanical dynamics of an RF MEMS switch Proc. IEEE. ICMENS'05
12. McCarthy B, Adams G G, McGruer N E and Potter D 2002 Dynamic model, including contact bounce, of an electrostatically actuated microswitch J. Microelectromech. Syst. 3 276-83
13. Decuzzi P, Demelio G P, Pascazio G and Zaza V 2006 Bouncing dynamics of resistive microswitches with an adhesive tip J. Appl. Phys. 100 024313
14. Granaldi A and Decuzzi P 2006 The dynamic response of resistive microswitches: switching time and bouncing J. Micromech. Microeng. 7 1108-15
15. Ma W, Zohar Y and Wang M 2003 Design and characterization of inertial-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology J. Micromech. Microeng. 6 892-9
16. Ma W, Li G, Zohar Y and Wang M 2004 Fabrication and packaging of inertial micro-switch using low-temperature photo-resist molded metal-electroplating technology Sensors Actuators A 1 63-70
17. Greywall D S 2007 MEMS-based inertial switch US Patent US7218193B2
18. Yang Z, Ding G, Cai H and Zhao X 2008 A MEMS inertia switch with bridge-type elastic fixed electrode for long duration contact IEEE Trans. Electron Devices 9 2492-7
19. Jones E E, Begley M R and Murphy K D 2003 Adhesion of micro-cantilevers subjected to mechanical point loading: modeling and experiments J. Mech. Phys. Solids 51 1601-22
20. Tas N, Sonnenberg T, Jansen H, Legtenberg R and Elwenspoek M 1996 Stiction in surface micromachining J. Micromech. Microeng. 6 385-97
21. Rogers J W and Phinney L M 2001 Process yield for laser repair of aged, stiction-failed, MEMS devices J. Microelectromech. Syst. 2 280-5
22. Lee K and Kim B 2005 MEMS spring probe for non-destructive wafer level chip test J. Micromech. Microeng. 5 953-7