DSC characterisation of ureaformaldehyde (UF) resin curing

Pigment & Resin Technology

Volumn 38, Issue 1, 2009, Pages 3-9

  Gao, Z ^a   Wang, XM ^a   Wan, H ^a   Liu, ZhiMing ^b  

^a FORINTEK CANADA CORP   (Canada)

^b NORTHEAST FORESTRY UNIVERSITY   (China)

Author keywords

Bonding; Composite materials; Resins; Wood products; Wood technology

Indexed keywords

BASE BUFFERS; BONDING SYSTEMS; CHARACTERISATION; COMPOSITE PANELS; CURING CHARACTERISTICS; CURING RATES; DESIGN/METHODOLOGY/APPROACH; KINETIC CHARACTERISTICS; MEDIUM-DENSITY FIBREBOARD; MODEL EQUATIONS; PEAK TEMPERATURES; PH VALUE; RESIN CURING; RESIN SOLIDS; UREA FORMALDEHYDE; WOOD EXTRACTS;

CATALYSIS; CATALYSTS; COMPOSITE MATERIALS; COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FORMALDEHYDE; MATHEMATICAL MODELS; METABOLISM; PARTICLE BOARD; RESINS; UREA; WOOD PRODUCTS;

UREA FORMALDEHYDE RESINS;

BONDING; CALORIMETRY; CATALYSTS; COMPOSITES; CURING; FORMALDEHYDE; MATHEMATICAL MODELS; METABOLISM; PARTICLE BOARDS; SIMULATION; SYNTHETIC POLYMERS; UREA; WOOD;

EID: 67651154193     PISSN: 03699420     EISSN: None     Source Type: Journal    
DOI: 10.1108/03699420910923526     Document Type: Article

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