A molecular dynamics simulation on surface tension of liquid Ni and Cu

Computational Materials Science

Volumn 46, Issue 2, 2009, Pages 516-519

  Hou, H Y ^a   Chen, G L ^a,b   Chen, G ^a   Shao, Y L ^a  

^a NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Copper; Liquid metal; Molecular dynamics; Nickel; Surface tension

Indexed keywords

EXPERIMENTAL DATA; EXPERIMENTAL VALUES; MECHANICAL METHODS; MOLECULAR DYNAMICS SIMULATIONS; SIMULATED RESULTS; SURFACE STRESS; TEMPERATURE COEFFICIENT; TIGHT BINDING POTENTIAL;

CAPILLARITY; LIQUID METALS; MOLECULAR DYNAMICS; NICKEL; NICKEL ALLOYS; STRESSES; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; SURFACE WAVES; TRANSITION METALS; WETTING;

DYNAMICS;

EID: 67651092135     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2009.04.001     Document Type: Article

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